Director, HBM SoC Design - TPG
Company: Micron Memory Malaysia Sdn Bhd
Location: Dallas
Posted on: November 6, 2024
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Job Description:
Our vision is to transform how the world uses information to
enrich life for all.Micron Technology is a world leader in
innovating memory and storage solutions that accelerate the
transformation of information into intelligence, inspiring the
world to learn, communicate and advance faster than ever.Our
Opportunity Summary:For more than 43 years, Micron Technology, Inc.
has redefined innovation with the world's most advanced memory and
semiconductor technologies. We're an international team of
visionaries and scientists, developing groundbreaking technologies
that are transforming how the world uses information to enrich
life.As the Director of HBM SoC Design, you will lead a team of HBM
SoC Design Engineers within the Heterogeneous Integration Group
(HIG). Your team will be responsible for the design, development,
and integration of digital and analog circuits, including complex
IP blocks. This role involves simulating, optimizing, and floor
planning various blocks. You will collaborate with Micron's global
design and verification teams and support groups such as Product
Engineering, Test, Probe, Process Integration, Assembly, and
Marketing to proactively design HBM products that optimize
manufacturing functions and ensure the best performance, power,
cost, quality, reliability, time-to-market, and customer
satisfaction.In HBM DEG (High Bandwidth Memory - DRAM Engineering
Group), we innovate and integrate end-to-end groundbreaking
front-end and backend processes with groundbreaking design,
debugging various tests, and qualification techniques to develop
the lowest power per bit solutions to improve customer experience
in the field of ML (Machine Learning) and AI (Artificial
Intelligence). The success of a sophisticated product such as HBM
relies vastly on vertical integration and the various engineering
working in unison. To provide greater detail, our HBM technology
pertains to stacking numbers of DRAM chips along with a logic chip
within one package through an assembly technology called TSV
(Through Silicon Via). This greatly increases the memory density in
a package, while allowing very high-speed signal transmission.
Furthermore, "high bandwidth"; is an outstanding memory design area
where custom gate-level design and RTL style logic design are
blended into the same product, and most of the DDR or LPDDR design
is based on the gate-level design only. Lastly, verification and
testing (validation) of HBM is the most challenging due to the
total size of the design and complexity of the functions, and in
addition to craft, many innovations are needed for verification and
validation of the HBM product, thereby making it uniquely
exciting.Our team vision is a continuing desire to develop your
skills working in an inclusive diverse environment of multicultural
Teams across worldwide geographies! Enabling the creative career
path you deserve with a collaborative environment and
groundbreaking technology and growing upon your imagination and
creativity.What's Encouraged Daily:
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Keywords: Micron Memory Malaysia Sdn Bhd, Grapevine , Director, HBM SoC Design - TPG, Executive , Dallas, Texas
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